Login to Website

Login dengan Facebook


 

Casing, Power Supply & Cooling Tempat menjual dan membeli alat komputer seperti casing, ups, dan fan

Post Reply
Listing Tools
  #1  
Old 22nd October 2012
Kompuret's Avatar
Kompuret
Ceriwis Lover
 
Join Date: Oct 2012
Posts: 1,783
Rep Power: 15
Kompuret mempunyai hidup yang Normal
Default Best CPU Cooler By Thermolab Korea

Kondisi Barang : Baru

Harga :



Lokasi Seller : Jawa Barat


Description :



Our Store :







SUMBER UTAMA Branch BANDUNG

Taman Kopo Indah II Blok 3A No.84

Bandung

HP : 087823783723

YM : [email protected]













1. TRINITY > Rp.450.000,





[/spoiler]
Spoiler for open this:
Spoiler for open this:
for Features TRINITY:






Balanced performance, low noise and compatibility CPU Cooler





Optimal arrangement of heatpipes derived from a great many heat analysis is the crucial factor of best cooling performance.





TRINITY is able to cool a maximum 220watts Optimized for 150watt - 200watt CPU power dissipation.





Heat pipes are arranged in an optimal position for efficient heat exchange with minimal air resistance.





Optimal base flatness is assured by precise CNC milling after the heatsink is fully assembled.





TRINITY's 130mm fan blows air down onto the motherboard, cooling nearby CPU power VRM components.





TRINITY outperforms other heatsinks of same class at low fan speed (800-1200rpm)





TRINITY uses a 130mm fan designed by Thermolab for low noise, high air flow rate

Anti-vibration silicon fan mounts included with TRINITY block all tiny vibrations to the heatsink and computer case.

Asymmetry but balanced structure enhance the cooling performance, and decrease the inteference with POWER










Spoiler for open this:
Spoiler for open this:
for SPEC:






Applicable CPU : Intel Socket LGA1155, 1156, 1366, 775 / AMD Socket AM3, AM2+, AM2



Dimension :





Spec:













Lokal Review : http://xtreme-hardware.com/thermolab...-review.html/1

International : ThermoLab / News - "TRINITY" Reviews updated (Intel 1155,1156,1366,775 AMD AM3,AM2+,AM2)



2. BARAM2010 > Rp. 470.000, GAMBAR FAN HANYA ILUSTRASI. BARAM TIDAK TERMASUK KIPAS-




Spoiler for open this:
Spoiler for open this:
for Features BARAM2010:






Applicable CPU :

* Socket Standards : Intel Socket 1155, 1156, 1366, 775 CPUs, AMD Socket AM3/AM2 /AM2 CPUs

* Thermal Design Power of CPU : Max 250 Watt

* BARAM2010 NOT INCLUDE FAN



Tech Specs

Product Name : BARAM 2010

Dimension : 67 � 132 � 160 (L x W x H)mm

Weight(Heatsink With Fan) : 710g

Heatsink Material : Pure Copper, Aluminum

Dissipation Area : 8,900 cm�










Spoiler for open this:
Spoiler for open this:
for Gallery BARAM2010:
















Review visit : http://sumberutama.net/baram_2010.html



3. BADA2010 > Rp. 270.000,-




Spoiler for open this:
Spoiler for open this:
for Features BADA2010:






Applicable CPU

* Socket Standards : Intel Socket 1155, 1156, 1366, 775 CPUs, AMD Socket AM3/AM2 /AM2 CPUs

* Thermal Design Power of CPU : Max 150 Watt



Tech Specs

Product Name : BADA 2010

Fan : 92mm PWM Long Life Rifle Bearing Max.2100rpm 17~20dBA

Dimension : 95 � 115 � 135 (L x W x H)mm

Weight(Heatsink With Fan) : 521g

Heatsink Material : Pure Copper, Aluminum

Dissipation Area : 5,175 cm�



1. Width of 165mm or more is excellent compatibility in the middle case.

2. Low rpm (Max.2100rpm) of the 4-Pin Round 92mm PWM fan effect

3. Noise (17 ~ 20dBA) the most effective cooling performance in the heat sink design

4. Apply anti-vibration silicone fan mounts

5. Including high-performance thermal grease

6. cooling performance comparable to the cooler

7. A variety of sockets










Spoiler for open this:
Spoiler for open this:
for Gallery BADA2010:
















Review visit : http://www.sumberutama.net/bada_2010.html





4. TL5-H3.5g Thermal Compound > Rp. 60.000,-




Spoiler for open this:
Spoiler for open this:
for TL5-H3.5g:






Ratio of Thermal transfer material and thermal conductivity are increased by mixing various sizes and particles.

Electric conductivity is removed and thermal conductivity is remarkably increased by mixing metal and ceramic particles in the optimum ratio.

Applicable for : CPU

GPU

Chipset Memory

Power Module

Other semiconductor components, High Heat Flux



Description :

Conductivity : 8W/mK

Viscosity : 190 Pa � s

Weight : 2.6

Capacity : 3.7g � 0.2

Color : Gray



Components :

Thermal Grease: 3.7g � 0.2 (syringe-type container)

Rubber Bone: 5

User's Guide: Part 1










[spoiler=open this] for Gallery TL5-H3.5g:


















Review visit : Sumber Utama - Best Quality IT Products


Sponsored Links
Space available
Post Reply

« Previous Listing | Next Listing »



Switch to Mobile Mode

no new posts